品應用产品应用
产品应用
LGA Smart Card/超薄型SIM卡
The advanced technique reduces the thickness of flexible thin SIM form factor to 200 um only. The ultra-slim feature allows the thin SIM to be combined with existing SIM card to support multi-function such as encryption, telecommunication, and brings more business opportunity for the traditional SIM card.
先进技术使超薄型SIM卡可达业界最薄仅 200 um 封装厚度,软板特性与超薄封装使其能与现有SIM卡结合,常应用于加密或通讯领域,并为现有传统SIM卡增添附加价值。