產品應用

MPK provides wafer level package solution, including WL-CSP, RDL, FOiP/SESUP, and Multi-chip package with reasonable cost and reliable performance that meets customer’s needs in various application.

MPK 提供的WL-CSP晶圓級封裝解決方案，包含CSP、RDL、FOiP/SESUP、Multi-chip 封裝等，能以合乎效益的成本與可靠的效能滿足客戶在不同應用領域的需求。