Products & Applications
Products & Applications
Wafer Level CSP/RDL
Chip size : 9.75mm x 8.75mm
Width : 0.05mm Spacing : 0.025mm
Ball size : 0.4mm
Chip size : 0.8mm x 0.7mm
Width : 0.05mm Spacing : 0.025mm
Ball size : 0.15mm
MPK provides wafer level package solution, including WL-CSP, RDL, FOiP/SESUP, and Multi-chip package with reasonable cost and reliable performance that meets customer’s needs in various application.
➤ Wafer Level Package
➤ CSP
➤ RDL
➤ Bumping
➤ SiP
